Description:
BGA reball heated stencil:
SCEI (Sony Computer Entertainment, Inc.) CXD90026G SoC 0.55mm solder
SCEI (Sony Computer Entertainment, Inc.) CXD90026G SoC 0.55mm solder
SCEI CXD90025G Secondary/Low Power Processor for Network Tasks 0.40mm solder
Samsung K4B2G1646E-BCK0/2Gb DDR3 SDRAM 0.40mm solder
Samsung K4G41325FC-HC03/ 4 Gb (512 MB) GDDR5 RAM 0.40mm solder
Item:
1* PS4 GPU CXD90026G CXD90025G DDR3 DDR5 BGA Direct Heat Stencil Template Kit (4 Piece Kit)
| Weight | 0.01 kg |
|---|---|
| Dimensions | 4.6 × 4.6 × 0.4 cm |
Who is our customer?
If you are B2B seller, trading company, shop owner, maintenance service provider, or facotry, please contact our professional sales, and they will provide you with more details and help to expland your business. Don't hesitate!









