- High-Efficiency Heat Conduction: As a liquid metal thermal medium, it features a thermal conductivity of 128W/m·K, enabling rapid heat transfer from core components like CPUs and GPUs to significantly reduce operating temperatures.
- Optimized for High-Load Scenarios: Ideal for overclocking, gaming, professional rendering, and other high-load applications, it meets the cooling demands of high-performance hardware and ensures stable operation.
- Precise Gap Filling: The fluid nature of liquid metal fully fills micro-gaps between the cooling base and chip surface, improving heat transfer efficiency and reducing thermal resistance.
- Long-Term Stability: It has excellent chemical stability, resisting drying, powdering, and volatilization to maintain consistent cooling performance over time, minimizing the need for reapplication.
- Broad Compatibility: Suitable for various heat-generating components, including CPUs, GPUs, VRAM, and MOSFETs, and works with both air-cooling and liquid-cooling systems.
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If you are B2B seller, trading company, shop owner, maintenance service provider, or facotry, please contact our professional sales, and they will provide you with more details and help to expland your business. Don't hesitate!

